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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10380825
Filing Dt:
08/20/2003
Publication #:
Pub Dt:
12/02/2004
Inventors:
Katsuyoshi Kubo, Takahide Otsuka, Masahiko Oka, Tsuyoshi Miyamori, Charles W. Stewart
Title:
Low-temperature-decomposable engineering plastic resin composition and production method of molding using the same
Assignment: 1
Reel/Frame:
014437/0001Recorded: 08/20/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/18/2003
Exec Dt:
04/18/2003
Exec Dt:
04/18/2003
Exec Dt:
12/09/2002
Exec Dt:
04/18/2003
Assignee:
4-12, NAKAZAKINISHI 2-CHOME, KITA-KU, OSAKA-SHI
UMEDA CENTER BUILDING
OSAKA, JAPAN 530-8323
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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