Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10456611
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Filing Dt:
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06/04/2003
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Publication #:
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Pub Dt:
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12/09/2004
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Inventors:
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M. Ziaul Karim, Bikram Kapoor, Anchuan Wang, Dong Qing Li, Katsunari Ozeki et al
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Title:
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HDP-CVD MULTISTEP GAPFILL PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 450 A |
| LEGAL AFFAIRS DEPARTMENT |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| P.O. BOX 450A, M/S 2061 |
| SANTA, CLARA, CA 95052 |
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