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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2006
Application #:
10801093
Filing Dt:
03/15/2004
Publication #:
Pub Dt:
12/09/2004
Inventors:
Terunao Hanaoka, Yasunori Kurosawa
Title:
SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, ELECTRONIC INSTRUMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
015630/0751Recorded: 08/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2004
Exec Dt:
07/07/2004
Assignee:
4-1, NISHI-SHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO, JAPAN
Correspondent:
HOGAN & HARTSON LLP
ANTHONY J. ORLER, ESQ.
500 SOUTH GRAND AVENUE
SUITE 1900
LOS ANGELES, CA 90071

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