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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/11/2008
Application #:
10492694
Filing Dt:
04/12/2004
Publication #:
Pub Dt:
12/09/2004
Inventors:
So Tanaka, Takashi Iwasaki
Title:
INDIUM-CONTAINING WAFER AND METHOD OF ITS MANUFACTURE
Assignment: 1
Reel/Frame:
015646/0384Recorded: 04/12/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/20/2004
Exec Dt:
02/20/2004
Assignee:
5-33, KITAHAMA 4-CHOME, CHUO-KU
OSAKA-SHI, JAPAN 541-0041
Correspondent:
JUDGE PATENT FIRM
RIVIERE SHUKUGAWA 3RD FL.
3-1 WAKAMATSU-CHO
NISHINOMIYA-SHI, HYOGO, JAPAN 662-0035

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