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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10491011
Filing Dt:
03/24/2004
Publication #:
Pub Dt:
12/16/2004
Inventors:
Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata
Title:
Flux composition for solder, solder paste, and method of soldering
Assignment: 1
Reel/Frame:
015702/0732Recorded: 03/24/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/09/2004
Exec Dt:
03/09/2004
Exec Dt:
03/09/2004
Exec Dt:
03/09/2004
Assignee:
20-3, EBISU 4-CHOME SHIBUYA-KU
TOKYO, JAPAN 150-0013
Correspondent:
DARBY & DARBY P.C.
S. PETER LUDWIG
P.O. BOX 5257
NEW YORK, NY 10150-5257

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