Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10785969
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Filing Dt:
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02/26/2004
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Publication #:
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Pub Dt:
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12/16/2004
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Inventors:
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Hiroshi Kobayashi, Naoki Ishikawa, Kenji Kobae, Hidehiko Kira, Norio Kainuma et al
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Title:
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SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP HAVING TERMINAL CONNECTION BUMPS FORMED OF TWO-LAYER WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO |
| 1725 K STREET, NW |
| SUITE 1000 |
| WASHINGTON, DC 20006 |
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