Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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10855210
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Filing Dt:
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05/26/2004
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Publication #:
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Pub Dt:
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12/16/2004
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Inventors:
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Kazuhiko Bandoh, Keiji Maeda, Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka et al
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Title:
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RESIN MOLD MATERIAL AND RESIN MOLD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5, KAMITOBA KAMICHOSHI-CHO |
MINAMI-KU, KYOTO-SHI |
KYOTO, JAPAN |
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4-1, MUTSUNO 2-CHOME |
ATSUTA-KU, NAGOYA-SHI |
AICHI, JAPAN |
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FASSE PATENT ATTORNEYS, PA |
WALTER F. FASSE |
P.O. BOX 726 |
HAMPDEN, MAINE 04444-0726 |
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