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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10696552
Filing Dt:
10/29/2003
Publication #:
Pub Dt:
12/16/2004
Inventors:
Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita, Andre Egli et al
Title:
Formaldehyde-free electroless copper plating process and solution for use in the process
Assignment: 1
Reel/Frame:
015700/0365Recorded: 08/16/2004Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/05/2004
Exec Dt:
07/02/2004
Exec Dt:
07/02/2004
Exec Dt:
07/02/2004
Exec Dt:
07/06/2004
Exec Dt:
07/06/2004
Assignee:
455 FOREST STREET
MARLBOROUGH, MASSACHUSETTS 01752
Correspondent:
EDWARDS & ANGELL, LLP
PETER F. CORLESS
P.O. BOX 55874
BOSTON, MA 02205

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