Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10462310
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Filing Dt:
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06/13/2003
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Publication #:
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Pub Dt:
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12/16/2004
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Inventors:
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Qingxin Zhang, Zhe Wang
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Title:
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Method to fabricate a highly perforated silicon diaphragm with controlable thickness and low stress
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 SCIENCE PARK ROAD, #01-01/03 THE ALPH |
| SINGAPORE SCIENCE PARK II, SINGAPORE 117684 |
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| GEORGE O. SAILE |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1151 MAPLEWOODDRIVE |
| ITASCA, ILLINOIS 60143 |
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| MARSHALL, GERSTEIN & BORUN |
| ANTHONY G. SITKO |
| 233 S. WACKER DRIVE, SUITE 6300 |
| CHICAGO, IL 60606-6357 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10017 |
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| FEDERAL RESEAERCH CORPORATION |
| PENELOPE JA. AGODOA |
| 130 FIFTEENTH STREET NW, SUITE 920 |
| WASHINGTON, DC 200005 |
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