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Patent Assignment Abstract of Title
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Total Assignments: 13
Patent #:
6933333
Issue Dt:
08/23/2005
Application #:
10458038
Filing Dt:
06/11/2003
Publication #:
20040254294
Pub Dt:
12/16/2004
Inventors:
John Clulow, Jody Riddle, Francis Zappitelli
Title:
CONDUCTIVE ADHESIVE SEALANT FOR BIPOLAR FUEL CELL SEPARATOR PLATE ASSEMBLIES
Assignment: 1
Reel/Frame:
014164/0392Recorded: 06/11/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CLULOW, JOHN
Exec Dt:
06/06/2003
RIDDLE, JODY
Exec Dt:
06/06/2003
ZAPPITELLI, FRANCIS
Exec Dt:
06/06/2003
Assignee:
BULK MOLDING COMPOUNDS INC.
1600 POWLS COURT
WEST CHICAGO, ILLINOIS 60185
Correspondent:
JACK SCHUMAN
3762 CARMEL DRIVE
CARMEL, IN 46033
Assignment: 2
Reel/Frame:
020897/0056Recorded: 05/03/2008Pages: 6
Conveyance:
SECURITY AGREEMENT
Assignor:
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
05/02/2008
Assignee:
JPMORGAN CHASE BANK, N.A.
10 S. DEARBORN STREET
22ND FLOOR
CHICAGO, ILLINOIS 60603
Correspondent:
ZEYNEP GIESEKE
233 S. WACKER DRIVE, SUITE 5800
LATHAM & WATKINS LLP
CHICAGO, IL 60606-6401
Assignment: 3
Reel/Frame:
021291/0469Recorded: 07/25/2008Pages: 6
Conveyance:
SECURITY AGREEMENT
Assignor:
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
05/02/2008
Assignee:
DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
ONE NORTH FRANKLIN STREET
SUITE 3500
CHICAGO, ILLINOIS 60606
Correspondent:
SARAH ENDRES
C/O GOLDBERG KOHN, 55 E. MONROE ST.
STE. 3300
CHICAGO, IL 60603
Assignment: 4
Reel/Frame:
021731/0909Recorded: 10/27/2008Pages: 6
Conveyance:
SECURITY AGREEMENT
Assignor:
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
05/02/2008
Assignee:
MCG CAPITAL CORPORATION
1100 WILSON BOULEVARD
SUITE 3000
ARLINGTON, VIRGINIA 22209
Correspondent:
COHEN & GRIGSBY, P.C.
625 LIBERTY AVENUE
PITTSBURGH, PA 15222-3152
Assignment: 5
Reel/Frame:
025575/0055Recorded: 01/03/2011Pages: 5
Conveyance:
AMENDED AND RESTATED ASSIGNMENT FOR SECURITY
Assignors:
DYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENT
Exec Dt:
12/23/2010
MCG CAPITAL CORPORATION, AS COLLATERAL AGENT
Exec Dt:
12/23/2010
Assignee:
CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
10 S. DEARBORN STREET, MAILCODE: IL1-0548
CHICAGO, ILLINOIS 60603
Correspondent:
SHARON PATTERSON, PARALEGAL
C/O GOLDBERG KOHN, 55 E. MONROE ST.
STE 3300
CHICAGO, IL 60603
Assignment: 6
Reel/Frame:
027795/0189Recorded: 03/02/2012Pages: 9
Conveyance:
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL
Assignor:
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Exec Dt:
02/29/2012
Assignees:
THE MATRIXX GROUP INCORPORATED
15000 U.S. HIGHWAY 41 NORTH
EVANSVILLE, INDIANA 47725
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
CITADEL INTERMEDIATE HOLDINGS, LLC
150 N. RADNOR CHESTER ROAD, SUITE F-200
RADNOR, PENNSYLVANIA 19087
Correspondent:
LINDA A. SALERA
1 FEDERAL STREET
C/O BINGHAM MCCUTCHEN LLP
BOSTON, MA 02110
Assignment: 7
Reel/Frame:
027795/0203Recorded: 03/02/2012Pages: 9
Conveyance:
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY
Assignor:
CHASE CAPITAL CORPORATION, AS COLLATERAL AGENT
Exec Dt:
02/29/2012
Assignees:
THE MATRIXX GROUP INCORPORATED
15000 U.S. HIGHWAY 41 NORTH
EVANSVILLE, INDIANA 47725
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
CITADEL INTERMEDIATE HOLDINGS, LLC
150 N. RADNOR CHESTER ROAD, SUITE F-200
RADNOR, PENNSYLVANIA 19087
Correspondent:
LINDA A. SALERA
1 FEDERAL STREET
C/O BINGHAM MCCUTCHEN LLP
BOSTON, MA 02110
Assignment: 8
Reel/Frame:
027808/0818Recorded: 03/05/2012Pages: 10
Conveyance:
PATENT SECURITY AGREEMENT
Assignors:
HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.
Exec Dt:
02/29/2012
CITY ACQUISITION MERGER SUB, INC.
Exec Dt:
02/29/2012
CITADEL PLASTICS HOLDINGS, INC.
Exec Dt:
02/29/2012
CITADEL INTERMEDIATE HOLDINGS, LLC
Exec Dt:
02/29/2012
THE MATRIXX GROUP, INCORPORATED
Exec Dt:
02/29/2012
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
02/29/2012
Assignee:
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
500 WEST MONROE STREET
CHICAGO, ILLINOIS 60661
Correspondent:
LINDA A. SALERA
1 FEDERAL STREET
C/O BINGHAM MCCUTCHEN LLP
BOSTON, MA 02110
Assignment: 9
Reel/Frame:
034478/0787Recorded: 11/26/2014Pages: 13
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
11/05/2014
PREMIX, INC.
Exec Dt:
11/05/2014
QUANTUM COMPOSITES, INC.
Exec Dt:
11/05/2014
Assignee:
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
500 WEST MONROE STREET
CHICAGO, ILLINOIS 60661
Correspondent:
CHRISTINE GUTHRIE
575 MADISON AVENUE
NEW YORK, NY 10022
Assignment: 10
Reel/Frame:
035808/0027Recorded: 06/02/2015Pages: 12
Conveyance:
SECURITY AGREEMENT
Assignors:
A. SCHULMAN, INC.
Exec Dt:
06/01/2015
BULK MOLDING COMPOUNDS, INC.
Exec Dt:
06/01/2015
Assignee:
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
10 SOUTH DEARBORN, FLOOR L2, IL1-1145
CHICAGO, ILLINOIS 60603
Correspondent:
ELAINE CARRERA, LEGAL ASSISTANT
80 PINE STREET
C/O CAHILL GORDON & REINDEL LLP
NEW YORK, NY 10005
Assignment: 11
Reel/Frame:
035756/0526Recorded: 06/01/2015Pages: 7
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Exec Dt:
06/01/2015
Assignees:
CITADEL PLASTICS HOLDINGS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
CITADEL INTERMEDIATE HOLDINGS, LLC
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
THE MATRIXX GROUP, INCORPORATED
15000 U.S. HIGHWAY 41 NORTH
EVANSVILLE, INDIANA 47725
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
HGGC CITADEL PLASTICS INTERMEDIATE HOLDINGS, INC.
1950 UNIVERSITY AVENUE
E. PALO ALTO, CALIFORNIA 94303
PREMIX, INC.
6151 WILSON MILLS ROAD, SUITE 310
HIGHLAND HEIGHTS, OHIO 44143
QUANTUM COMPOSITES, INC.
6151 WILSON MILLS ROAD, SUITE 310
HIGHLAND HEIGHTS, OHIO 44143
Correspondent:
CHRISTINE GUTHRIE
575 MADISON AVENUE
NEW YORK, NY 10022
Assignment: 12
Reel/Frame:
035756/0985Recorded: 06/01/2015Pages: 5
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Exec Dt:
06/01/2015
Assignees:
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
PREMIX, INC.
6151 WILSON MILLS ROAD, SUITE 310
HIGHLAND HEIGHTS, OHIO 44143
QUANTUM COMPOSITES, INC.
6151 WILSON MILLS ROAD, SUITE 310
HIGHLAND HEIGHTS, OHIO 44143
Correspondent:
CHRISTINE GUTHRIE
575 MADISON AVENUE
NEW YORK, NY 10022
Assignment: 13
Reel/Frame:
046883/0607Recorded: 08/21/2018Pages: 10
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
JPMORGAN CHASE BANK, N.A.
Exec Dt:
08/21/2018
Assignees:
A. SCHULMAN, INC.
3637 RIDGEWOOD ROAD
FAIRLAWN, OHIO 44333-1678
PREMIX, INC.
3637 RIDGEWOOD RD.
FAIRLAWN, OHIO 44333-1678
BULK MOLDING COMPOUNDS, INC.
1600 POWIS COURT
WEST CHICAGO, ILLINOIS 60185
QUANTUM COMPOSITES, INC.
3637 RIDGEWOOD RD.
FAIRLAWN, OHIO 44333-1678
Correspondent:
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219

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