Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10864334
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Filing Dt:
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06/10/2004
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Publication #:
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Pub Dt:
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12/23/2004
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Inventor:
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Yoshikatsu Seki
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Title:
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Wiring board, semiconductor device and process of fabricating wiring board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO 381-2287, JAPAN |
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| STAAS & HALSEY LLP |
| ALICIA M. CHOI |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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