Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10890583
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Filing Dt:
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07/14/2004
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Publication #:
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Pub Dt:
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12/23/2004
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Inventors:
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Hirokazu Masuda, Takashi Takahashi
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Title:
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Method of bonding substrates and apparatus for bonding substrates
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KASAMA, 3-CHOME |
| SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA, 247-8610, JAPAN |
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| VOLPE AND KOENIG, P.C. |
| ROBERT J. BALLARINI |
| 30 SOUTH 17TH STREET |
| UNITED PLAZA, SUITE 1600 |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME ON A PREVIOUSLY RECORDED ASSIGNMENT AT REEL 015569, FRAME 0249
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| 5-1, KASAMA 2-CHOME, SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 247-8610 |
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| VOLPE AND KOENIG, P.C. |
| UNITED PLAZA, SUITE 1600 |
| ROBERT J. BALLARINI |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103 |
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