Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/16/2007
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Application #:
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10824647
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Filing Dt:
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04/15/2004
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Publication #:
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Pub Dt:
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12/30/2004
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Inventors:
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Yoshitaka Toyoda, Minoru Ueshima, Tsukasa Ohnishi, Takeshi Tashima, Masazumi Amagai et al
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Title:
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LEAD-FREE SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23 SENJU-HASHIDO-CHO |
ADACHI-KU, TOKYO 120-8555, JAPAN |
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MICHAEL TOBIAS |
1717 K STREET, N.W., SUITE 613 |
WASHINGTON, DC 20036 |
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