Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10851091
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Filing Dt:
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05/24/2004
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Publication #:
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Pub Dt:
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12/30/2004
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Inventors:
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Yasuyoshi Horikawa, Akio Rokugawa, Takahiro Iijima
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Title:
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Wiring substrate manufacturing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO 381-2287, JAPAN |
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| ARMSTRONG, KRATZ, QUINTOS, HANSON ET AL |
| WILLIAM G. KRATZ, JR. |
| 1725 K STREET, N.W., SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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