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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10612590
Filing Dt:
07/01/2003
Publication #:
20050001316
Pub Dt:
01/06/2005
Inventors:
Timothy B. Dean, Terance Blake, Gregory J. Dunn, Remy J. Chelini, William H. Lytle et al
Title:
Corrosion-resistant bond pad and integrated device
Assignment: 1
Reel/Frame:
014263/0195Recorded: 07/01/2003Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DEAN, TIMOTHY B.
Exec Dt:
05/27/2003
BLAKE, TERANCE
Exec Dt:
05/27/2003
DUNN, GREGORY J.
Exec Dt:
05/27/2003
CHELINI, REMY J.
Exec Dt:
05/27/2003
LYTLE, WILLIAM H.
Exec Dt:
05/23/2003
FAY, OWEN R.
Exec Dt:
05/23/2003
STRUMBERGER, GEORGE A.
Exec Dt:
05/27/2003
Assignee:
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD
SCHAUMBURG, ILLINOIS 60196
Correspondent:
CARDINAL LAW GROUP
FRANK C. NICHOLAS
1603 ORRINGTON AVENUE SUITE 2000
EVANSTON, IL 60201
Assignment: 2
Reel/Frame:
015735/0156Recorded: 02/15/2005Pages: 64
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MOTOROLA, INC.
Exec Dt:
12/10/2004
Assignee:
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON
DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
ROBERT L. KING
7700 WEST PARMER LANE
AUSTIN, TX 78729

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