Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10881276
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Filing Dt:
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06/30/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Inventors:
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Minoru Otani, Jun Hisada, Toyoki Mawatari
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Title:
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Copper compound and method for producing copper thin film using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HIGASHIHATSUSHIMA-CHO |
| AMAGASAKI-SHI |
| HYOGO, JAPAN 660-0832 |
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| MERCHANT & GOULD P.C. |
| DOUGLAS P. MUELLER |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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