Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10496379
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Filing Dt:
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05/24/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Inventors:
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Kiyoshi Mitani, Kiyoshi Demizu, Isao Yokokawa, Tadahiro Ohmi, Shigetoshi Sugawa
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Title:
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BONDED WAFER AND METHOD OF PRODUCING BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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OLIFF & BERRIDGE, PLC |
JAMES A. OLIFF |
P.O. BOX 19928 |
ALEXANDRIA, VA 22320 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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OLIFF & BERRIDGE, PLC |
WILLIAM P. BERRIDGE |
P.O. BOX 19928 |
ALEXANDRIA, VA 22320 |
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