Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10680668
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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01/06/2005
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Inventors:
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Hiroshi Horikoshi, Yuji Segawa, Takeshi Nogami
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Title:
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Method of producing a semiconductor device having copper wiring
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35, KITASHINAGAWA 6-CHOME |
| SHINAGAWA-KU |
| TOKYO 141-0032, JAPAN |
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| SONNENSCHEIN NATH & ROSENTHAL LLP |
| P.O. BOX 061080 |
| WACKER DRIVE STATION, SEARS TOWER |
| CHICAGO, IL 60606-1080 |
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