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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/25/2007
Application #:
10502976
Filing Dt:
07/30/2004
Publication #:
Pub Dt:
01/13/2005
Inventors:
Benedicto de los Santos, James T. Huneke, Puwei Liu, Kang Yang, Qing Ji
Title:
INTERLAYER DIELECTRIC AND PRE-APPLIED DIE ATTACH ADHESIVE MATERIALS
Assignment: 1
Reel/Frame:
019905/0295Recorded: 10/02/2007Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/30/2003
Exec Dt:
06/30/2003
Exec Dt:
06/30/2003
Exec Dt:
06/30/2003
Exec Dt:
06/25/2003
Assignee:
1001 TROUT BROOK CROSSING
ROCKY HILL, CONNECTICUT 06067
Correspondent:
STEVEN C. BAUMAN
HENKEL CORPORATION
1001 TROUT BROOK CROSSING
ROCKY HILL, CT 06067
Assignment: 2
Reel/Frame:
019905/0329Recorded: 10/02/2007Pages: 5
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/15/2003
Assignee:
1001 TROUT BROOK CROSSING
ROCKY HILL, CONNECTICUT 06067
Correspondent:
STEVEN C. BAUMAN
HENKEL CORPORATION
1001 TROUT BROOK CROSSING
ROCKY HILL, CT 06067

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