Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10494687
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Filing Dt:
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05/05/2004
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Publication #:
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Pub Dt:
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01/20/2005
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Inventor:
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Akira Yoshida
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Title:
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Cushioning material for hot pressing and process for producing layered board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7, SHODAI-TAJIKA 2-CHOME |
| HIRAKATA-SHI, OSAKA, JAPAN 573-1132 |
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| BIRCH, STEWART, KOLASCH, ET AL. |
| JAMES T. ELLER, JR. |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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