Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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10896993
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Filing Dt:
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07/23/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Inventors:
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Helmut Kiendl, Horst Theuss, Michael Weber
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Title:
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SEMICONDUCTOR COMPONENT OF SEMICONDUCTOR CHIP SIZE WITH FLIP-CHIP-LIKE EXTERNAL CONTACTS, AND METHOD OF PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| 81669 MUNICH, GERMANY |
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| EDELL, SHAPIRO & FINNAN, LLC |
| HEATHER MORIN |
| 1901 RESEARCH BLVD., SUITE 400 |
| ROCKVILLE, MD 20850 |
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