Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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09/04/2007
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Application #:
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10925302
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Filing Dt:
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08/24/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Inventors:
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Jin-Yuan Lee, Eric Lin
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Title:
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METHOD FOR FABRICATING THERMAL COMPLIANT SEMICONDUCTOR CHIP WIRING STRUCTURE FOR CHIP SCALE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN, CHINA |
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| GEORGE O. SAILE |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 47, PARK 2ND RD. SCIENCE-BASED INDUSTRIAL PARK |
| ROOM 301/302 |
| HSINCHU, TAIWAN |
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| SAILE ACKERMAN, LLC |
| 28 DAVIS AVENUE |
| POUGKEEPSIE, NY 12601 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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