skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10860115
Filing Dt:
06/04/2004
Publication #:
20050023149
Pub Dt:
02/03/2005
Inventors:
Tsutomu Nakada, Junji Kunisawa, Hiroyuki Kanda, Mizuki Nagai, Satoru Yamamoto et al
Title:
Plating apparatus, plating method and substrate processing apparatus
Assignment: 1
Reel/Frame:
015865/0332Recorded: 09/27/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAKADA, TSUTOMU
Exec Dt:
06/21/2004
KUNISAWA, JUNJI
Exec Dt:
06/21/2004
KANDA, HIROYUKI
Exec Dt:
06/21/2004
NAGAI, MIZUKI
Exec Dt:
06/21/2004
YAMAMOTO, SATORU
Exec Dt:
06/21/2004
MISHIMA, KOJI
Exec Dt:
06/21/2004
MORISAWA, SHINYA
Exec Dt:
06/21/2004
KATSUOKA, SEIJI
Exec Dt:
06/21/2004
MAKINO, NATSUKI
Exec Dt:
06/21/2004
FUKUNAGA, YUKIO
Exec Dt:
06/21/2004
Assignee:
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU
TOKYO, JAPAN
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
MICHAEL S. HUPPERT, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, D.C. 20006-1021

Search Results as of: 04/19/2024 05:33 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT