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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/12/2006
Application #:
10865230
Filing Dt:
06/09/2004
Publication #:
Pub Dt:
02/03/2005
Inventors:
Yan Zhao, Chang-Chun Yeh, Zhong-Wei Chen, Jack Jau
Title:
METHOD FOR IN-LINE MONITORING OF VIA/CONTACT HOLES ETCH PROCESS BASED ON TEST STRUCTURES IN SEMICONDUCTOR WAFER MANUFACTURING
Assignment: 1
Reel/Frame:
015845/0406Recorded: 10/04/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/27/2004
Exec Dt:
09/26/2004
Exec Dt:
09/29/2004
Exec Dt:
09/23/2004
Assignee:
18 CREATIN ROAD 1
SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
TOWNSEND AND TOWNSEND AND CREW LLP
DANIEL MAO
TWO EMBARCADERO CENTER EIGHTH FLOOR
SAN FRANCISCO, CA 94111-3834
Assignment: 2
Reel/Frame:
054866/0742Recorded: 12/29/2020Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2018
Assignee:
DE RUN 6501
VELDHOVEN, NETHERLANDS 5504 DR
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
901 NEW YORK AVENUE, NW
WASHINGTON, DC 20001
Assignment: 3
Reel/Frame:
054870/0156Recorded: 12/29/2020Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2018
Assignee:
DE RUN 6501
VELDHOVEN, NETHERLANDS 5504 DR
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
901 NEW YORK AVENUE, NW
WASHINGTON, DC 20001

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