Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10935412
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Filing Dt:
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09/07/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Inventors:
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Ying Ma, Michael Jones, Thomas H. Baum, Deepak Verma, David Bernhard
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Title:
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Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7 COMMERCE DRIVE |
| DANBURY, CONNECTICUT 06810 |
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| TRISTAN A. FUIERER |
| 430 DAVIS DRIVE, SUITE 500 |
| PO BOX 13706 |
| RESEARCH TRIANGLE PA, NC 27709 |
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