Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10636105
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Filing Dt:
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08/07/2003
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Publication #:
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Pub Dt:
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02/10/2005
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Inventors:
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Wushing Yin, Ning-Cheng Lee
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Title:
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Integrated underfill process for bumped chip assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1676 LINCOLN AVENUE |
| UTICA, NEW YORK 13503 |
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| WEINGARTEN, SCHURGIN, GAGNEBIN ET AL. |
| STANLEY M. SCHURGIN |
| TEN POST OFFICE SQUARE |
| BOSTON, MA 02109 |
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