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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10841384
Filing Dt:
05/07/2004
Publication #:
Pub Dt:
02/10/2005
Inventors:
Gang Zhang, Adam L. Cohen
Title:
Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
Assignment: 1
Reel/Frame:
044944/0372Recorded: 02/15/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/20/2004
Exec Dt:
10/13/2004
Assignee:
7911 HASKELL AVENUE
VAN NUYS, CALIFORNIA 91406
Correspondent:
DENNIS R. SMALLEY
7911 HASKELL AVENUE
VAN NUYS, CA 91406
Assignment: 2
Reel/Frame:
016089/0498Recorded: 12/20/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/02/2004
Assignee:
3716 HOPE STREET, SUITE 313
LOS ANGELES, CALIFORNIA 90007
Correspondent:
MICROFABRICA INC.
ATT: DENNIS R. SMALLEY
1103 W. ISABEL STREET
BURBANK, CALIFORNIA 91506

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