Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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10481751
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Filing Dt:
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12/23/2003
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Publication #:
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Pub Dt:
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02/10/2005
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Inventors:
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Susumu Matsuoka, Seiichi Inoue, Haremi Ito, Keiji Matsumoto
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Title:
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DIE FOR MOLDING HONEYCOMB STRUCTURE AND MANUFACTURING METHOD
THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-CITY, AICHI-PREFECTURE, 467-8530, JAPAN |
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| OLIFF & BERRIDGE PLC |
| JAMES A. OLIFF |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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