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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/26/2010
Application #:
10381342
Filing Dt:
09/24/2003
Publication #:
Pub Dt:
02/24/2005
Inventor:
Siu-Wai Chan
Title:
THICK FILM HIGH TEMPERATURE SUPERCONDUCTING DEVICE SUPPORTING HIGH CRITICAL CURRENTS AND METHOD FOR FABRICATING SAME
Assignment: 1
Reel/Frame:
014519/0413Recorded: 09/24/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/15/2003
Assignee:
116TH STREET AND BROADWAY
NEW YORK, NEW YORK 10027
Correspondent:
BAKET BOTTS LLP
PAUL D. ACKERMAN
30 ROCKEFELLER PLAZA
44TH FL.
NEW YORK, NY 10112
Assignment: 2
Reel/Frame:
021647/0380Recorded: 10/08/2008Pages: 2
Conveyance:
EXECUTIVE ORDER 9424, CONFIRMATORY LICENSE
Assignor:
Exec Dt:
06/23/2008
Assignee:
4201 WILSON BLVD.
ROOM 1265
ARLINGTON, VIRGINIA 22230
Correspondent:
FAITH E. HIXSON
4201 WILSON BLVD.
ROOM 1265
ARLINGTON, VA 22230

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