Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10885447
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Filing Dt:
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07/06/2004
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Publication #:
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Pub Dt:
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02/24/2005
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Inventors:
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Takami Hikita, Takashi Kondo, Amane Mochizuki
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Title:
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Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA 567-8680, JAPAN |
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| OSHA & MAY L.L.P. |
| JONATHAN P. OSHA |
| 1221 MCKINNEY ST., SUITE 2800 |
| HOUSTON, TX 77010 |
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