Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10841382
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Filing Dt:
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05/07/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Inventors:
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Gang Zhang, Adam L. Cohen, Michael S. Lockard, Ananda H. Kumar, Ezekiel J. J. Kruglick et al
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Title:
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Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3716 HOPE STREET, SUITE 313 |
| LOS ANGELES, CALIFORNIA 90007 |
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| MICROFABRICA INC. |
| ATT: DENNIS R. SMALLEY |
| 1103 W. ISABEL STREET |
| BURBANK, CA 91506 |
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