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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10922980
Filing Dt:
08/23/2004
Publication #:
Pub Dt:
03/03/2005
Inventors:
Shuang-Feng Yeh, Been Jon Woo
Title:
Processing method for increasing packaging density of an integrated circuit
Assignment: 1
Reel/Frame:
015097/0808Recorded: 09/01/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/10/2004
Exec Dt:
08/10/2004
Assignee:
818 GUOSHOUJING ROAD
ZHANGJIANG HI-TECH PARK
SHANGHAI 201203, CHINA
Correspondent:
ROSENBERG, KLEIN & LEE
MORTON J. ROSENBERG, ESQ.
3458 ELLICOTT CENTER DRIVE, SUITE 101
ELLICOTT CITY, MARYLAND 21043

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