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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10972884
Filing Dt:
10/25/2004
Publication #:
Pub Dt:
03/17/2005
Inventors:
Liang-Yuh Chen, Wei-Yung Hsu, Alain Duboust, Ratson Morad, Daniel A. Carl
Title:
Planarization of substrates using electrochemical mechanical polishing
Assignment: 1
Reel/Frame:
015927/0442Recorded: 10/25/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2002
Exec Dt:
03/27/2002
Exec Dt:
03/27/2002
Exec Dt:
03/27/2002
Exec Dt:
04/03/2002
Assignee:
P.O. BOX 450-A
PATENT COUNSEL
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
P.O. BOX 450-A
PATENT COUNSEL
SANTA CLARA, CA 95052

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