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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	10886716	Filing Dt:	07/09/2004
Publication #:	20050061659	Pub Dt:	03/24/2005
Inventors:	Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima et al
Title:	Plating apparatus and plating method

Assignment: 1

Reel/Frame:

016041/0573

Recorded: 12/03/2004

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

KURASHINA, KEIICHI

Exec Dt:

10/01/2004

NAGAI, MIZUKI

Exec Dt:

10/01/2004

YAMAMOTO, SATORU

Exec Dt:

10/01/2004

KANDA, HIROYUKI

Exec Dt:

10/01/2004

MISHIMA, KOJI

Exec Dt:

10/01/2004

BAKER, BRETT

Exec Dt:

10/01/2004

KWIETNIAK, KEITH

Exec Dt:

10/12/2004

DELIGIANNI, HARIKLIA

Exec Dt:

10/07/2004

ANDRICACOS, PANOS

Exec Dt:

10/13/2004

Assignees:

EBARA CORPORATION

11-1, HANEDA ASAHI-CHO, OHTA-KU

TOKYO, JAPAN

INTERNATIONAL BUSINESS MACHINES CORPORATION

NEW ORCHARD ROAD

ARMONK, NEW YORK 10504

Correspondent:

WENDEROTH, LIND & PONACK, L.L.P.

MICHAEL S. HUPPERT

2033 K STREET, N.W., SUITE 800

WASHINGTON, DC 20006-1021

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