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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10672433
Filing Dt:
09/26/2003
Publication #:
Pub Dt:
03/31/2005
Inventors:
MacKenzie E. King, Weihua Wang, Jianwen Han, Michele Stawasz, Jeffrey F. Roeder et al
Title:
Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
Assignment: 1
Reel/Frame:
014561/0957Recorded: 09/26/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/24/2003
Exec Dt:
09/24/2003
Exec Dt:
09/24/2003
Exec Dt:
09/24/2003
Exec Dt:
09/25/2003
Exec Dt:
09/25/2003
Assignee:
7 COMMERCE DRIVE
DANBURY, CONNECTICUT 06810
Correspondent:
ADVANCED TECHNOLOGY MATERIALS, INC.
WILLIAM F. RYANN, ESQ.
7 COMMERCE DRIVE
DANBURY, CT 06810

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