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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10952203
Filing Dt:
09/28/2004
Publication #:
Pub Dt:
03/31/2005
Inventors:
Ryosuke Usui, Hideki Mizuhara, Takeshi Nakamura
Title:
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
Assignment: 1
Reel/Frame:
015847/0584Recorded: 09/28/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/2004
Exec Dt:
09/03/2004
Exec Dt:
09/03/2004
Assignee:
5-5, KEIHAN-HONDORI 2-CHOME
MORIGUCHI-SHI
OSAKA 570-8677, JAPAN
Correspondent:
FISH & RICHARDSON P.C.
SAMUEL BORODACH
153 EAST 53RD STREET, 52ND FLOOR
CITIGROUP CENTER
NEW YORK, NY 10022-4611

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