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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10958300
Filing Dt:
10/06/2004
Publication #:
Pub Dt:
04/07/2005
Inventors:
Shunichi Abe, Kouji Yufu, Naoki Izumi, Akira Yamazaki
Title:
Lead frame, semiconductor device, and method for manufacturing semiconductor device
Assignment: 1
Reel/Frame:
015875/0579Recorded: 10/06/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/17/2004
Exec Dt:
09/21/2004
Exec Dt:
09/28/2004
Exec Dt:
09/28/2004
Assignee:
4-1, MARUNOUCHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-6334
Correspondent:
MCDERMOTT WILL & EMERY LLP
STEPHEN A. BECKER
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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