Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/06/2008
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Application #:
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10752614
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Filing Dt:
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01/07/2004
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Publication #:
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Pub Dt:
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04/07/2005
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Inventors:
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Richard Hill, Jason Strader
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Title:
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THERMAL INTERFACE ASSEMBLY AND METHOD FOR FORMING A THERMAL INTERFACE BETWEEN A MICROELECTRONIC COMPONENT PACKAGE AND HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4707 DETROIT AVENUE |
| CLEVELAND, OHIO 44102-2216 |
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| ANDERSON KILL & OLICK |
| EUGENE LIEBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 3481 RIDER TRAIL SOUTH |
| EARTH CITY, MISSOURI 63045 |
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| HUSCH BLACKWELL LLP |
| 190 CARONDELET PLAZA |
| SUITE 600 |
| ST. LOUIS, MO 63105 |
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