Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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10721164
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Filing Dt:
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11/26/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Inventors:
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Etsuko Nakamura, Kazumasa Wakiya
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Title:
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LOWER LAYER MATERIAL FOR WIRING, EMBEDDED MATERIAL, AND WIRING FORATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150 NAKAMARUKO, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-0012, JAPAN |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| MATTHEW M. JACOB, ESQ. |
| 2033 K STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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