Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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10680509
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Inventors:
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Kuang Chien Hsieh, Keh-Yung Cheng, Kuo-Lih Chang, John H. Epple, Gregory Pickrell
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Title:
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ADHESIVE BONDING WITH LOW TEMPERATURE GROWN AMORPHOUS OR POLYCRYSTALLINE COMPOUND SEMICONDUCTORS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 506 S. WRIGHT |
| 352 HENRY ADMINISTRATION BUILDING |
| URBANA, ILLINOIS 61801 |
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| BRINKS HOFER GILSON & LIONE |
| ANTHONY P. CURTIS, PH.D. |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 3701 NORTH FAIRFAX DRIVE |
| OFFICE OF THE GENERAL COUNSEL |
| ARLINGTON, VIRGINIA 22203 |
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| KIMBERLY B. DOWNEY |
| 3701 NORHT FAIRFAX DRIVE |
| OFFICE OF THE GENERAL COUNSEL |
| ARLINGTON, VA 22203 |
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