Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10733650
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Filing Dt:
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12/11/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Inventor:
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Hyung Jun Kim
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Title:
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Method for polishing copper layer and method for forming copper layer wiring using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI BUBAL-EUB, ICH'ON |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| LADAS & PARRY |
| RICHARD J. STREIT |
| 224 SOUTH MICHIGAN AVENUE |
| CHICAGO, IL 60604 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK |
| CHEONGJU CITY, CHUNG CHEONG BOK-DO, KOREA, REPUBLIC OF |
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| MATTHEW T. SMITH |
| DECHERT LLP |
| 4000 BELL ATLANTIC TOWER |
| 1717 ARCH STREET |
| PHILADELPHIA, PA 19103-2793 |
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