Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10683143
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Filing Dt:
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10/09/2003
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Publication #:
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Pub Dt:
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04/14/2005
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Inventors:
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Hui Chen, Chun Yan, Wai-Fan Yau
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Title:
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Method for planarizing an interconnect structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 450-A |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| P.O. BOX 450-A |
| SANTA CLARA, CA 95052 |
| 7373ETCHMETAL |
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