Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10686640
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Filing Dt:
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10/17/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Inventors:
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Paul Stephen Andry, Leena Paivikki Buchwalter, Russell Alan Budd et al
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Title:
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SILICON CHIP CARRIER WITH THROUGH-VIAS USING LASER ASSISTED CHEMICAL VAPOR DEPOSITION OF CONDUCTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CONNOLLY BOVE LODGE ET AL |
| JOHN A. EVANS |
| 1990 M STREET, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20036-3425 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED ON REEL 014618 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| 1101 KITCHAWAN ROAD, ROUTE 134, P.O. BOX 218 |
| YORKTOWN, NY 10598 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ELPIS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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