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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/01/2006
Application #:
10927123
Filing Dt:
08/27/2004
Publication #:
Pub Dt:
04/21/2005
Inventors:
Naruhiko Kaji, Katsumi Yoneda
Title:
METHOD OF FABRICATING MULTILAYER INTERCONNECT WIRING STRUCTURE HAVING LOW DIELECTRIC CONSTANT INSULATOR FILM WITH ENHANCED ADHESIVITY
Assignment: 1
Reel/Frame:
016111/0199Recorded: 12/27/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/30/2004
Exec Dt:
09/28/2004
Assignee:
16-1 ONOGAWA
TSUKUBA-SHI
IBARAKI, 305-0053, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
015693/0189Recorded: 02/09/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/01/2005
Assignee:
1-1 SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314

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