Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10696186
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Filing Dt:
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10/29/2003
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Publication #:
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Pub Dt:
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05/05/2005
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Inventors:
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Meng-Chi Hung, Shang-Yung Hou, Shin-Puu Jeng
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Title:
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BONDING PAD STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C., TAIWAN |
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| THOMAS, KAYDEN, HORSTEMEYER & ET AL |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GEORGIA 30339-5948 |
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