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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/17/2007
Application #:
10706156
Filing Dt:
11/12/2003
Publication #:
Pub Dt:
05/12/2005
Inventors:
Tai-Chun Huang, Chih-Hsiang Yao, Yih-Hsiung Lin, Tien-I Bao, Bi-Trong Chen, Yung-Cheng Lu
Title:
INTEGRATION FILM SCHEME FOR COPPER / LOW-K INTERCONNECT
Assignment: 1
Reel/Frame:
014390/0785Recorded: 03/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2003
Exec Dt:
11/13/2003
Exec Dt:
12/19/2003
Exec Dt:
11/13/2003
Exec Dt:
11/13/2003
Exec Dt:
11/13/2003
Assignee:
NO. 6, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
STEVEN H. SLATER
17950 PRESTON RD, SUITE 1000
DALLAS, TX 75252-5793

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