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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10911730
Filing Dt:
08/05/2004
Publication #:
20050101143
Pub Dt:
05/12/2005
Inventors:
Seung-Jae Lee, Min Kim, Jai-Dong Lee, Kyoung-Seok Kim, Ju-Bum Lee, Hun-Hyeoung Leam et al
Title:
Methods of fabricating a semiconductor device and forming a trench region in a semiconductor device
Assignment: 1
Reel/Frame:
015663/0815Recorded: 08/05/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, SEUNG-JAE
Exec Dt:
07/13/2004
KIM, MIN
Exec Dt:
07/13/2004
LEE, JAE-DONG
Exec Dt:
07/13/2004
KIM, KYOUNG-SEOK
Exec Dt:
07/13/2004
LEE, HYEON-DEOK
Exec Dt:
07/13/2004
LEE, JU-BUM
Exec Dt:
07/13/2004
LEAM, HUN-HYEOUNG
Exec Dt:
07/13/2004
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE, PLC
P.O. BOX 8910
RESTON, VA 20195
Assignment: 2
Reel/Frame:
016265/0264Recorded: 02/16/2005Pages: 4
Conveyance:
RECORD TO CORRECT THE NAME OF THE 3RD CONVEYING PARTY, PREVIOUSLY RECORDED AT REEL 015663, FRAME 0815.
Assignors:
LEE, SEUNG-JAE
Exec Dt:
07/13/2004
KIM, MIN
Exec Dt:
07/13/2004
LEE, JAI-DONG
Exec Dt:
07/13/2004
KIM, KYOUNG-SEOK
Exec Dt:
07/13/2004
LEE, HYEON-DEOK
Exec Dt:
07/13/2004
LEE, JU-BUM
Exec Dt:
07/13/2004
LEAM, HUN-HYEOUNG
Exec Dt:
07/13/2004
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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