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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/20/2007
Application #:
10714966
Filing Dt:
11/18/2003
Publication #:
Pub Dt:
05/19/2005
Inventors:
Cyril Cabral JR., Stefanie R. Chiras, Emanuel I. Cooper, Hariklia Deligianni et al
Title:
ELECTROPLATED COWP COMPOSITE STRUCTURES AS COPPER BARRIER LAYERS
Assignment: 1
Reel/Frame:
014714/0786Recorded: 11/18/2003Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/2003
Exec Dt:
11/07/2003
Exec Dt:
11/07/2003
Exec Dt:
11/07/2003
Exec Dt:
11/06/2003
Exec Dt:
11/07/2003
Exec Dt:
11/07/2003
Assignee:
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
CONNOLLY BOVE LODGE & HUTZ LLP
BURTON A. AMERNICK
1990 M STREET, N.W., SUITE 800
WASHINGTON, DC 20036-3425
Assignment: 2
Reel/Frame:
036267/0191Recorded: 08/06/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/29/2014
Assignee:
121, PARK AVE.3, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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