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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10941022
Filing Dt:
09/15/2004
Publication #:
Pub Dt:
05/19/2005
Inventor:
Susumu Hoshino
Title:
Polishing equipment, and method of manufacturing semiconductor device using the equipment
Assignment: 1
Reel/Frame:
016156/0249Recorded: 01/14/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/24/2004
Assignee:
2-3, MARUNOUCHI 3-CHOME
CHIYODA-KU, TOKYO 100-8331, JAPAN
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE NW
WASHINGTON, DC 20004

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