Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
03/03/2009
|
Application #:
|
10965868
|
Filing Dt:
|
10/18/2004
|
Publication #:
|
|
Pub Dt:
|
05/26/2005
| | | | |
Inventors:
|
Tetsuya Osaka, Tokihiko Yokoshima, Isao Sato, Akira Hashimoto, Yoshio Hagiwara
|
Title:
|
SEMICONDUCTOR MULTILAYER WIRING BOARD AND METHOD OF FORMING THE SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
104, TOTSUKA-MACHI 1-CHOME |
SHINJYUKU-KU, TOKYO 169-8050, JAPAN |
|
|
150 NAKAMARUKO, NAKAHARA-KU |
KAWASAKI-SHI |
KANAGAWA PREFECURE 211-0012, JAPAN |
|
|
|
WENDEROTH LIND & PONACK, L.L.P. |
ATTN: JEFFREY R. FILIPEK, ESQ. |
2033 K STREET, N.W. |
SUITE 800 |
WASHINGTON, DC 20006-1021 |
|
|
Search Results as of:
04/27/2024 08:45 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|